Simcenter Micred T3Ster SI
T3Ster SI is a high-precision transient thermal measurement system for ICs, power semiconductors and electronic packages. Using the device's own temperature-sensitive electrical parameter to measure junction temperature, it records the transient thermal response during heating or cooling and derives thermal resistance, thermal impedance and structure function data.
The method is non-destructive and reveals the complete heat-flow path from the die junction to ambient — ideal for package development, die-attach and TIM quality inspection, and simulation model calibration.
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Applications
- Thermal characterization of ICs, power semiconductors and electronic packages
- Precision transient measurement of IGBTs, MOSFETs, power modules and high-power chips
- Junction-to-case Rth measurement (JESD51-14) and still-air testing (JESD51-2A)
Optional Accessories
T3Ster Booster (240 A / 11 V)
High-current expansion for high-power devices, up to 240 A heating current.
Still Air Chamber
Standardized natural-convection environment per JEDEC JESD51-2 / 51-2A.
Dual Cold Plate
Two identical liquid-cooled plates, separable, for calibration and junction-to-case measurement.